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process_tech [2015/12/17 22:49] – [Cheesing / bamboo structures] azonenbergprocess_tech [2025/08/04 21:23] (current) – external edit 127.0.0.1
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 Many dense interconnect layers, as with 4-7 layer devices, but with the addition of a dedicated power layer (or layers) on top metal for improved power distribution performance and to avoid cluttering high-density interconnect layers with power busing. Many dense interconnect layers, as with 4-7 layer devices, but with the addition of a dedicated power layer (or layers) on top metal for improved power distribution performance and to avoid cluttering high-density interconnect layers with power busing.
  
-Example image (Xilinx XC6SLX4, 45nm Samsung process, probably ~12 layers). Top metal wires are massive, at least 5μm.+Example image (Xilinx XC6SLX4, 45nm Samsung process, 9 layers). Top metal wires are massive, at least 5μm.
  
 {{:azonenberg:process_examples:topmetal_power.jpg?600|}} {{:azonenberg:process_examples:topmetal_power.jpg?600|}}
process_tech.1450392587.txt.gz · Last modified: 2015/12/17 22:49 by azonenberg