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--- repackage [2015/02/15 06:29] – created mcmaster
+++ repackage [2015/12/17 23:35] (current) – removed azonenberg
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-http://www.forcetechnologies.co.uk/services/manufacturing/die-reclamation
-  * Mechanically removes bond wires
-http://www.asminternational.org/web/tss/resources/conference-proceedings?p_p_auth=2op8k7VA&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=3166940&_101_type=content&_101_groupId=10192&_101_urlTitle=non-chemical-solder-bump-removal-technique-for-repackaging-flip-chip-ics
-  * Wick solder bumps to gold surface