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foundry:start [2012/02/18 21:20] – [Shanghai Hua Hong NEC Electronics Company, Ltd.] mcmasterfoundry:start [2025/11/17 23:53] (current) – mcmaster
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 A foundry is an IC fabrication facility. A foundry is an IC fabrication facility.
  
-====== austriamicrosystems (AMS) ======+This page lists all known foundries regardless of whether they are internal-only or offer their services to the public.
  
-Processes +====== List of foundries ======
-C18 @ 0.18 µm +
-H18 @ 0.18 µm +
-C35B4C3 @ 0.35 µm +
-C35B4M3 @ 0.35 µm +
-C35B4O1 @ 0.35 µm +
-H35B4D3 @ 0.35 µm +
-S35D4 @ 0.35 µm+
  
-====== BAE Systems ======+{{topic>foundry}}
  
-BAE Systems Information and Electronic Systems Integration, Inc. (Manassas, VA) +====== Foundry ID (FIXME: clean up) ======
-BAE Systems Micrwave Electronics Center Nashua (Nashua, NH)+
  
-====== Chartered Semiconductor Manufacturing (CSM) ======+Device vendors concerned about reverse engineering often use simple tricks to make it harder to put a BOM together. One of these is to remove the labeling from, or even re-label with a laser engraver, various ICs on the board. Re-labeling can also be done for brand reasons.
  
-Acquired by Global Foundries in 2010 +The first step in identifying an unknown components is to determine the vendor. If there's no logo on the die this can be difficult, but fab processes vary enough from vendor to vendor that some hints can be gained just by looking at the die structure.
-0.13 µm +
-300 mm wafers+
  
-Dongbu +This page is a library of specific process examples, not a place to discuss general fabrication techniques. General fab topics belong on the [[siliconprawn>process_tech|process technology]] page.
-90 nm to 0.35 um +
-"Dongby HiTek's broad and deep semiconductor expertise encompasses High Voltage (HV), Application-Specific Integrated Circuit (ASIC), CMOS Image Sensor (CIS), Digital Signal Processor (DSP), Microcontroller Unit (MCU), and Non-Volatile Memory (e-Flash) devices."+
  
-====== GlobalFoundries ======+====== CMP fill ======
  
-Processes +Although only present on smaller (<=350nm typically) process technology, CMP fill patterns are distinctive enough that a pretty good guess of the vendor can sometimes be obtained from the fill pattern alone.
-  * 28nm +
-  * 40nm +
-  * 65nm +
-  * 0.13um/0.11um +
-  * 0.18um +
-  * 0.35um+
  
-===== Fab 1 - Dresden, Germany =====+All images shown are top metal with overglass intact, unless otherwise labeled.
  
-  * "45nm and below" +Please try to include scale bars in all images. 
-  * 300 mm wafer+===== Actel =====
  
-===== Fab 2 - Singapore =====+{{:mcmaster:foundry:actel_a54sx32a_mit20x.jpg?500|}}
  
-  * 0.6- to 0.35-micron +===== Adaptec =====
-  * 200 mm wafer+
  
-===== Fab 3/5 - Singapore =====+{{:mcmaster:foundry:adaptec:7902:ns50xu_0.jpg?500|}}
  
-  * 0.35-micron to 0.18-micron +===== ATI radeon =====
-  * 200 mm wafer+
  
 +{{:mcmaster:foundry:ati_radeon_probably_mit20x.jpg?500|}}
  
-===== Fab 3E - Singapore =====+===== Atmel =====
  
-  * 0.18-micron +==== 350nm aluminum ====
-  * 200 mm wafer+
  
-===== Fab 6 - Singapore =====+FIXME: get a picture with a scale bar
  
-  * 0.18- to 0.11-micron +The fill pattern is very distinctive and looks like a "brick wall" - short lines staggered every other row.
-  * 200 mm wafer+
  
-===== Fab 7 - Singapore =====+{{:protected:vendorid:flylogic-atmel-350nm-cmpfill.jpg?500|}}
  
-0.13-micron to 40nm+(image copyright Christopher Tarnovsky, originally published on [[http://www.flylogic.net/blog/?p=23|Flylogic blog]], used with permission)
  
-===== Fab 8 - Saratoga County, NY =====+===== Cisco Systems =====
  
-28nm and below+{{:mcmaster:foundry:cisco_ibm_100x.jpg?500|}}
  
-====== Grace Semiconductor ======+IBM logo on chip. Am100x objective?
  
-Processes +===== FTDI =====
-  * 0.25 um +
-  * 0.18 um +
-  * 0.16 um +
-  * 0.15 um +
-  * 0.14 um +
-  * 0.13 um +
-  * 0.115 um+
  
-====== He Jian Technology Corporation (HJTC) ======+{{:protected:vendorid:ft232rl_15_bf_neo40x_annotated.jpg?500|}}
  
-Processes +===== Microchip =====
-  * 0.18 um +
-  * 0.25 um +
-  * 0.35 um +
-  * 8" and 200 mm wafers+
  
-====== Honeywell ======+==== 350nm aluminum ====
  
-Honeywell Aerospace Plymouth (Plymouth, MN)+Example image from PIC12F683. Overglass generally appears deep red to orange, CMP fill is long straight lines.
  
-HRL Labratories LLC+{{:protected:vendorid:microchip-350nm-cmpfill.jpg?500|}} 
  
-Malibu, CA+==== 250nm copper ====
  
-====== IBM ======+The exact geometry of this process isn't known but it's copper damascene and significantly smaller than the 350.
  
-Main article+Example image from ENC424J600. Overglass appears orange to yellow. CMP fill is short lines.
  
-====== Intersil Corporation ====== 
  
-Palm Bay. FL+{{:protected:vendorid:microchip-250nm-cmpfill.jpg?500|}}
  
-====== MagnaChip ======+==== pic32mx695f ====
  
-Processes +{{:mcmaster:foundry:pic32mx695f_512h-80ip_mit20x.jpg?500|}}
-  * 0.5 um +
-  * 0.35 um +
-  * 0.30 / 0.25 um +
-  * 0.18 / 0.16 um +
-  * 0.15 um +
-  * 0.13 / 0.11 um +
-  * 90 nm+
  
 +===== Myricom =====
  
-====== National Semiconducdtor Corporation ======+{{:mcmaster:foundry:myricom_not_crossbar.jpg?500|}}
  
-  * South Portland, ME +===== NXP / Philips =====
-  * 0.65 um to 0.13 um +
-  * CMOS and BiCMOS with SOI, SiGe, and Hi Voltage +
-  * Ability to add unique number generator to ID individual dies: 256 bit+
  
-====== NEC ======+==== Unknown geometry, possibly 220nm ====
  
-===== Shanghai Hua Hong NEC Electronics Company, Ltd. =====+Fill pattern is large square patches of metal with spaces between them.
  
-  * 1 um +{{:protected:vendorid:nxp-250nm-cmpfill.jpg?500|}}
-  * 0.5 um +
-  * 0.45 um +
-  * 0.35 um +
-  * 0.3 um +
-  * 0.25 um +
-  * 0.18 um +
-  * 0.162 um +
-  * 0.16 um +
-  * 0.13 um+
  
-====== Silterra Malaysia Sdn. Bhd. ======+===== Sysmocom =====
  
-Processes +{{:mcmaster:foundry:sysmocom.jpg?500|}}
-  * 0.13µm +
-  * 0.18µm +
-  * 0.22µm+
  
-====== Semiconductor Manufacturing International Corporation (SMIC) ======+Has several fill patterns, second metal down is somewhat visible
  
-Processes+====== Routing ======
  
-    * 350 nm to 45nm+===== Power =====
  
-Foundries+===== Cell =====
  
-    * 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai (Mega-fab) 
-    * Two 300mm wafer fabs in its Beijing (Mega-fab) 
-    * 200mm wafer fab in Tianjin 
-    * 200mm wafer fab under construction in Shenzhen 
-    * 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and managed and operated by SMIC 
-    * 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation and managed and operated by SMIC 
  
 +====== Security mesh ======
  
 +Smartcard vendors are extremely secretive and competitive and the mesh patterns are all developed in house. If a device has mesh on it, a matching pattern can typically be considered a positive ID of the vendor.
  
-====== SSMC ======+===== Atmel =====
  
-0.25 um - 0.14 um +===== Infineon =====
-200 mm and 300 mm wafers+
  
-====== Northrup Gruman ======+===== Renesas =====
  
-Nortrup Grumman Electronic Systems (Blatimore, MD) +Die labeled R5H30201, found in an unlabeled QFN. 
-Northrup Grumman Space Technology (Redondo Beach, CA)+
  
-====== ON Semiconductor ======+The mesh runs vertically and horizontally.
  
-Processes +FIXME: get image rotated to canonical orientation on an edge of the die
-  * I3T25 @ 0.35 µm +
-  * I3T50 @ 0.35 µm +
-  * I3T80 @ 0.35 µm +
-  * C5F/C5N @ 0.50 µm +
-  * I2T100 @ 0.70 µm +
-  * I2T30 @ 0.70 µm+
  
-====== Peregrine ======+{{:protected:vendorid:renesas-mesh.jpg?500|}}
  
-Processes +{{:drm:renesas:r5h30201_1000x_20kv_19mm_6e-09a_se_18.jpg?500|}} 
-  * GA @ 0.25 µm +===== ST =====
-  * GC @ 0.25 µm +
-  * FA @ 0.50 µm +
-  * FC @ 0.50 µm+
  
-====== Rayethon RF Components ======+ST7 series smartcard, origin unknown. The mesh runs at a 45 degree angle to the vertical axis of the chip and consists of two conductors. 
  
-Andower, MA+This is one of the few images we have taken with a SEM rather than a light microscope because they're expensive to get time on. I (azonenberg) was imaging some MEMS prototypes on a Zeiss Supra 55 in the RPI cleanroom for a customer and decided to buy an extra hour of scope time out of my own pocket while I was in the lab.
  
-====== SAMSUN Semiconductor ======+The sample was not sputter-coated with anything conductive and had severe charging problems, this was the only image I got that was useful.
  
-Processes +FIXME: get image rotated into canonical orientation on an edge of the die
-  * 90 nm +
-  * 65 nm +
-  * 45 nm +
-  * 45/40nm +
-  * 32/28nm+
  
-300 mm wafers+{{:protected:vendorid:st7-mesh.jpg?500|}}
  
-====== Sarnoff Corporation ======+===== Xilinx =====
  
-Princeton, NJ+XC6SLX4 (45nm Samsung process). Damage to passivation was from overly aggressive cleaning.
  
-====== Semiconductor Manufacturing International Corporation (SMIC) ======+{{:azonenberg:foundry:xilinx:xc6slx4_24_bf_neo40x_annotated.jpg?500|}}
  
-0.35 um to 90nm+====== Test patterns ======
  
-====== Taiwan Semiconductor Manufacturing Company Limited (TSMC) ======+Test patterns and alignment marks are often very fab or vendor specific.
  
-Produces ICs for many third parties include such large organizations as nVidia. +====== Misc ======
-TODO: image some nVidia chips to see if we can capture some identifying marks. +
-Processes +
-  * CLN40/CMN40 @ 40 nm +
-  * CLN45/CMN45 @ 45 nm +
-  * CLN65/CMN65 @ 65 nm +
-  * CLN90/CMN90 @ 90 nm +
-  * CL013/CM013 @ 0.13 µm +
-  * CL013LP @ 0.13 µm +
-  * CL013LV @ 0.13 µm +
-  * CL018/CM018 @ 0.18 µm +
-  * CL018HV @ 0.18 µm +
-  * CL018LP @ 0.18 µm +
-  * CL018LV @ 0.18 µm +
-  * CL025/CM025 @ 0.25 µm +
-  * CL035/CM035 @ 0.35 µm +
-  * CL035HV_BCD @ 0.35 µm +
-  * CL035HV_DDD @ 0.35 µm +
-  * "65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm"+
  
-====== Texas Instruments (TI) ======+===== SandForce SF-2281VB1-SDC =====
  
-Processes +{{:mcmaster:foundry:sandforce_sf-2281vb1-sdc.jpg?500|}}
-  * 32 nm +
-  * 45 nm +
-  * 90 nm +
-  * 130 nm +
-  * 200 mm wafers+
  
-====== TowerJazz ====== 
- 
-Israel: 6” and 8” 
- 
-US: 8” 
- 
-China "manufacturing partnerships" 
- 
-"silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies" 
- 
-====== TriQuint Semiconductor ====== 
- 
-TriQuint Semiconductor Texas (Richardson, TX) 
- 
-====== United Microelectronic Corporation (UMC) ====== 
- 
-Processes 
-  * 28 nm 
-  * 40 nm 
-  * 65 nm 
-  * 90 nm 
-  * 0.13 um 
-  * 0.15 um 
-  * 0.18 um 
-  * 0.25 um 
-  * 0.35 um 
-  * 0.5 um 
-  * 0.6 um 
-  * 8" wafers 
- 
-====== Vanguard International Semiconductor Corporation (VIS) ====== 
- 
-0.18um to 0.5um 
- 
-8" wafers 
- 
-====== X-FAB Semiconductor Foundries ====== 
- 
-"CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP" 
  
 ====== References ====== ====== References ======
  
- +  - http://smithsonianchips.si.edu/ice/cd/PROF98/JAPAN.PDF 
-   1. http://www.mosis.com/products/fab/schedule/ +  - http://www.mosis.com/products/fab/schedule/ 
-   2. http://www.jazzsemi.com/fact-sheets.html +  - http://www.jazzsemi.com/fact-sheets.html 
-   3. http://www.national.com/vcm/NSC_Content/Files/en_US/Milaero/TrustedFoundryOverview.pdf +  - http://www.national.com/vcm/NSC_Content/Files/en_US/Milaero/TrustedFoundryOverview.pdf 
-   4. http://www.mosis.com/db/pubf/fsched?ORG=ON-SEMI +  - http://www.mosis.com/db/pubf/fsched?ORG=ON-SEMI 
-   5. http://www.mosis.com/db/pubf/fsched?ORG=AMS +  - http://www.mosis.com/db/pubf/fsched?ORG=AMS 
-   6. http://www.mosis.com/db/pubf/fsched?ORG=PEREGRINE +  - http://www.mosis.com/db/pubf/fsched?ORG=PEREGRINE 
-   7. http://www.interfacebus.com/semiconductor_wafer_foundry.html +  - http://www.interfacebus.com/semiconductor_wafer_foundry.html 
-   8. http://www.globalfoundries.com/services/global_shuttle.aspx +  - http://www.globalfoundries.com/services/global_shuttle.aspx 
-   9. http://www.globalfoundries.com/manufacturing/300mm.aspx +  - http://www.globalfoundries.com/manufacturing/300mm.aspx 
-  10. http://www.globalfoundries.com/manufacturing/200mm.aspx +  - http://www.globalfoundries.com/manufacturing/200mm.aspx 
-  11. http://www.umc.com/English/process/index.asp +  - http://www.umc.com/English/process/index.asp 
-  12. http://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation +  - http://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation 
-  13. http://www.dongbu.com/eng/product/product_list.asp?idx=2 +  - http://www.dongbu.com/eng/product/product_list.asp?idx=2 
-  14. http://www.vis.com.tw/english/b_services/b02_services.htm +  - http://www.vis.com.tw/english/b_services/b02_services.htm 
-  15. http://www.samsung.com/global/business/semiconductor/products/strategicfoundry/Products_ProcessTechnology.html +  - http://www.samsung.com/global/business/semiconductor/products/strategicfoundry/Products_ProcessTechnology.html 
-  16. http://www.gracesemi.com/Website/eWebEditor/Roadmap2010_new_big.jpg +  - http://www.gracesemi.com/Website/eWebEditor/Roadmap2010_new_big.jpg 
-  17. http://www.hjtc.com.cn/aboutHJ/PressRelease.asp +  - http://www.hjtc.com.cn/aboutHJ/PressRelease.asp 
-  18. http://www.hhnec.com/EN/Technology/index.aspx +  - http://www.hhnec.com/EN/Technology/index.aspx 
-  19. http://www.ssmc.com.sg/technology_portfolio.asp +  - http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf
-  20. http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf +
-  21. http://www.magnachip.com/eng/product/foundry/proc_portfolio.jsp+
  
foundry/start.1329600004.txt.gz · Last modified: 2013/01/22 05:38 (external edit)